MID

Feature	MID is a technology that integrates electronic functions and structural components by directly forming three-dimensional circuitry on resin-molded parts (housings). It contributes to miniaturization, weight reduction, and the reduction of component count and cost.
Uses	Antennas　LTE / Wi‑Fi / Bluetooth Heaters　Inkjet print heads Assembly modules　Touch sensors

Products designed and manufactured upon customer's requirements.
Please do not hesitate to contact us for more information.